Lead-freeSolder wire / 03
Lead-free solder wire
Tin-copper and silver-bearing alloys for hand soldering, automatic equipment and electronic assembly.
- R / RMA / RA flux-core options
- Fast wetting and low spatter
Product catalog / Complete range
Find your next
soldering material.
Compare six material families, ten product ranges and 35 alloy / grade entries. Start with your format and refine by lead status.
Download catalog ↧10 product ranges
Jump to alloy / grade matrix ↓Lead-free
Tin-leadSolder wire / 04
Tin-lead solder wire
Nine tin-lead grades, from precision PCB work to appliances, radiators and cable joints.
- Sn63Pb37 through Sn25Pb75
- Grade-specific diameters from 0.3 to 3 mm
Lead-freeSolder bars / 05
Lead-free solder bars
SnCu, SAC and pure tin options for wave soldering, solder baths and PCB electroplating.
- Sn99.95 pure tin at 232°C
- Anti-oxidation grades
Tin-leadSolder bars / 06
Tin-lead solder bars
Nine alloy compositions for solder baths and wave soldering, selected around the assembly process.
- Sn63Pb37 through Sn25Pb75
- 183–266°C across listed grades
Lead-freeSolder paste / 07
Lead-free solder paste
Low-, medium- and high-temperature formulations for LED assembly and demanding electronics.
- 500 g / jar
- 20–38 µm listed powder size
Tin-leadSolder paste / 08
Tin-lead solder paste
Type 3 and Type 4 powder options for LED, general SMT, fine-pitch, QFN and BGA work.
- 500 g / jar
- 20–38 µm or 25–45 µm by grade
Tin-leadSolder paste / 08
Semiconductor solder paste
High-lead die-attach paste for semiconductor assembly with a nitrogen reflow process.
- High-lead die attach
- Nitrogen reflow
Lead-freeTin balls / 09
Tin balls
Lead-free tin balls with 99.9% stated tin purity, good wetting and low dross.
- 99.9% stated purity
- Clean, bright appearance
Process materialSMT red adhesive / 09
SMT red adhesive
Single-component, heat-curing epoxy for controlled adhesive-dot shape in SMT placement.
- Single-component epoxy
- Heat-curing formulation
Process materialSoldering flux / 09
Soldering flux
Low-resin, low-halogen flux for good solderability and minimal post-solder residue.
- Low resin / low halogen
- Minimal post-solder residue
No matching materials.
Try another alloy, reset the filters or ask for material guidance.
Order specifications
Standard packing.
Standard bar and wire quantities for ordering and freight planning.
| Product | Unit | Carton | Custom option |
|---|---|---|---|
| Lead-free solder bars | 500 g per bar. Approx. 300 × 20 × 15 mm. Hand-formed, so dimensions may vary. | 40 bars per carton (20 kg net). Carton: 32 × 21 × 8 cm. | Custom 1 kg lead-free bars available. |
| Tin-lead solder bars | 500 g per bar. Approx. 300 × 20 × 15 mm. Hand-formed, so dimensions may vary. | 50 bars per carton (25 kg net). Carton: 32 × 21 × 8 cm. | — |
| Solder wire | 450 g or 900 g per spool. | 10 spools per carton. | Custom spool weights available. |
RoHS and SGS documentation ↗ · Ask our sales team which documents apply to your grade and batch.
Technical comparison / 35 entries
Specifications, side by side.
Filter the product range above to narrow this matrix. Select a row to carry the material and alloy into your enquiry.
35 alloy / grade entries shown
| Product / alloy (wt%) | Grade | Listed melt | Size / powder | Application | Enquire |
|---|---|---|---|---|---|
| Lead-free solder wireSn99.3Cu0.7 | Standard alloy | 227°C | Confirm diameter | Electronic assembly | Select ↗ |
| Lead-free solder wireSn99Ag0.3Cu0.7 | Standard alloy | 221°C | Confirm diameter | Electronic assembly | Select ↗ |
| Lead-free solder wireSn96.5Ag3.0Cu0.5 | Standard alloy | 217°C | Confirm diameter | Electronic assembly | Select ↗ |
| Tin-lead solder wireSn63Pb37 | 63A | 183°C | 0.3-3 mm | Electronic assembly | Select ↗ |
| Tin-lead solder wireSn60Pb40 | No. 1 | 183-190°C | 0.5-3 mm | Electronic assembly | Select ↗ |
| Tin-lead solder wireSn55Pb45 | No. 2 | 183-203°C | 0.5-3 mm | Electronic assembly | Select ↗ |
| Tin-lead solder wireSn50Pb50 | No. 3 | 183-216°C | 0.8-3 mm | Electronic assembly | Select ↗ |
| Tin-lead solder wireSn45Pb55 | No. 4 | 183-227°C | 0.8-3 mm | Electronic assembly | Select ↗ |
| Tin-lead solder wireSn40Pb60 | No. 5 | 183-238°C | 0.8-3 mm | Electronic assembly | Select ↗ |
| Tin-lead solder wireSn35Pb65 | No. 6 | 183-247°C | 0.8-3 mm | Electronic assembly | Select ↗ |
| Tin-lead solder wireSn30Pb70 | No. 7 | 183-255°C | 0.8-3 mm | Electronic assembly | Select ↗ |
| Tin-lead solder wireSn25Pb75 | No. 8 | 183-266°C | 0.8-3 mm | Electronic assembly | Select ↗ |
| Lead-free solder barsSn99.3Cu0.7 | Standard alloy | 227°C | 500 g · approx. 300 × 20 × 15 mm | Wave soldering, dip soldering, hand soldering | Select ↗ |
| Lead-free solder barsSn99Ag0.3Cu0.7 | Standard alloy | 221°C | 500 g · approx. 300 × 20 × 15 mm | Wave soldering, dip soldering, hand soldering | Select ↗ |
| Lead-free solder barsSn96.5Ag3.0Cu0.5 | Standard alloy | 217°C | 500 g · approx. 300 × 20 × 15 mm | Wave soldering, dip soldering, hand soldering | Select ↗ |
| Lead-free solder barsSn99.95 (pure tin) | Standard alloy | 232°C | 500 g · approx. 300 × 20 × 15 mm | Wave soldering, dip soldering, hand soldering | Select ↗ |
| Tin-lead solder barsSn63Pb37 | Standard alloy | 183°C | 500 g · approx. 300 × 20 × 15 mm | Wave soldering, dip soldering, hand soldering | Select ↗ |
| Tin-lead solder barsSn60Pb40 | Standard alloy | 183-190°C | 500 g · approx. 300 × 20 × 15 mm | Wave soldering, dip soldering, hand soldering | Select ↗ |
| Tin-lead solder barsSn55Pb45 | Standard alloy | 183-203°C | 500 g · approx. 300 × 20 × 15 mm | Wave soldering, dip soldering, hand soldering | Select ↗ |
| Tin-lead solder barsSn50Pb50 | Standard alloy | 183-216°C | 500 g · approx. 300 × 20 × 15 mm | Wave soldering, dip soldering, hand soldering | Select ↗ |
| Tin-lead solder barsSn45Pb55 | Standard alloy | 183-227°C | 500 g · approx. 300 × 20 × 15 mm | Wave soldering, dip soldering, hand soldering | Select ↗ |
| Tin-lead solder barsSn40Pb60 | Standard alloy | 183-238°C | 500 g · approx. 300 × 20 × 15 mm | Wave soldering, dip soldering, hand soldering | Select ↗ |
| Tin-lead solder barsSn35Pb65 | Standard alloy | 183-247°C | 500 g · approx. 300 × 20 × 15 mm | Wave soldering, dip soldering, hand soldering | Select ↗ |
| Tin-lead solder barsSn30Pb70 | Standard alloy | 183-255°C | 500 g · approx. 300 × 20 × 15 mm | Wave soldering, dip soldering, hand soldering | Select ↗ |
| Tin-lead solder barsSn25Pb75 | Standard alloy | 183-266°C | 500 g · approx. 300 × 20 × 15 mm | Wave soldering, dip soldering, hand soldering | Select ↗ |
| Lead-free solder pasteSn42Bi58 | Low-temperature | 138°C | 20-38 µm | LED assembly | Select ↗ |
| Lead-free solder pasteSn64.7Bi35Ag0.3 | Medium-temperature | 183°C | 20-38 µm | Demanding electronic assemblies | Select ↗ |
| Lead-free solder pasteSn64Bi35Ag1 | Medium-temperature | 183°C | 20-38 µm | Demanding electronic assemblies | Select ↗ |
| Lead-free solder pasteSn99Ag0.3Cu0.7 | High-temperature | 217°C* | 20-38 µm | Demanding electronic assemblies | Select ↗ |
| Tin-lead solder pasteSn55Pb45 | 55/45 - Type 3 | 190°C | 25-45 µm | LED placement | Select ↗ |
| Tin-lead solder pasteSn60Pb40 | 60/40 - Type 3 | 190°C | 25-45 µm | LED placement | Select ↗ |
| Tin-lead solder pasteSn63Pb37 | 63/37 - Type 3 | 183°C | 25-45 µm | General SMT placement | Select ↗ |
| Tin-lead solder pasteSn63Pb37 | 63/37 - Type 4 | 183°C | 20-38 µm | Fine-pitch placement | Select ↗ |
| Tin-lead solder pasteSn62.9Pb36.9Ag0.2 | Silver-bearing - Type 4 | 183°C | 20-38 µm | QFN assembly | Select ↗ |
| Tin-lead solder pasteSn62.8Pb36.8Ag0.4 | Higher-silver - Type 4 | 183°C | 20-38 µm | BGA reballing | Select ↗ |
No alloy rows match this selection. Auxiliary material details are available in the product cards above.
Melting values are reproduced by product format from the catalog. They are not reflow settings. Confirm the selected grade and process before production.
* Sn99Ag0.3Cu0.7 paste is listed at 217°C; wire and bars of this composition are listed at 221°C. Please confirm the paste grade.
Density figures are omitted from this quick-selection matrix because the catalog asks for confirmation of the unit. Request the applicable density specification at quotation.
Before you specify
A few details make the difference.
What should I include in a material request?
Share the alloy, process, wire diameter or powder size, estimated quantity and destination. For paste, include your reflow temperature limit and print requirements.
Are all lead-free products RoHS certified?
Lead-free alloy composition alone is not a product compliance certificate. Request the applicable test documentation for the exact grade and destination requirements.
What packaging and minimum quantity apply?
The catalog lists solder paste in 500 g jars. Confirm wire spool weight, bar dimensions, auxiliary-material packs and the minimum order with your quotation.
Can I request a sample and technical documents?
Include the selected grade and process in your enquiry. Sample availability, freight, product data, MSDS and applicable testing documents can be reviewed for the material.
Quotation / sample review
Your process.
Our starting point.
Share the alloy, size or powder grade, estimated quantity and destination. We will review the material and documentation with you.
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